When: |
26 May 2026 through 29 May 2026 | |
CFP Deadline: |
27 |
|
Where: |
Orlando, FL USA | |
Website URL: |
https://www.ectc.net | |
Sponsoring organization: |
IEEE Electronics Packaging Society | |
Categories: |
Engineering & Technology - Mechanical/Industrial |
Keywords:
Event description:
Premier IEEE packaging and microelectronics conference featuring advanced packaging, interconnects, reliability, and photonics integration; proceedings published in IEEE Xplore.
About ECTC
Bring your networking to the next level at ECTC! With technical sessions, panels, interactive presentations, a high energy exhibition floor, luncheons, evening receptions, and numerous coffee breaks you can connect with peers and leaders from semiconductor and electronics manufacturing, foundries and OSATs, substrate and materials suppliers, equipment makers, research institutions, design houses, and universities.
Posting date:
01 March 2026 | 36 views
Placement:
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