FEB 21

The International Conference on Engineering and Applied Sciences


Conference CFP




  21 Feb 2017 through 23 Feb 2017

CFP Deadline:

  10 Nov 2016


  Singapore, Singapore

Website URL:


Sponsoring organization:

  Higher Education Forum


  Engineering & Technology > Other

Cloud tags:

Event description:

Organized by Higher Education Forum (HEF), The International Conference on Engineering and Applied Sciences (TICEAS) is an international platform for scholars, researchers and practitioners to discuss interdisciplinary research and practices in the fields Mechanical Engineering, Material Science and Engineering, Fundamental and Applied Sciences, Environmental Engineering, Electrical & Electronic Engineering, Computing Science & IT Engineering, Biomedical Engineering, Chemical Engineering, Civil Engineering and More. 2017 TICEAS will take place from February 21-23, 2017 in Singapore. Prospective authors are invited to submit original research abstracts or full papers which were not, are not and have not been submitted/published/under consideration in other conferences and journals. For more information, please visit: http://ticeas.org or contact: t[email protected] Organized by Higher Education Forum

Posting date:

24 May 2016
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