When: |
21 Feb 2017 through 23 Feb 2017 | |
CFP Deadline: |
10 Nov 2016 | |
Where: |
Singapore, Singapore | |
Website URL: |
http://ticeas.org | |
Sponsoring organization: |
Higher Education Forum | |
Categories: |
Engineering & Technology > Other |
Cloud tags:
Event description:
Organized by Higher Education Forum (HEF), The International Conference on Engineering and Applied Sciences (TICEAS) is an international platform for scholars, researchers and practitioners to discuss interdisciplinary research and practices in the fields Mechanical Engineering, Material Science and Engineering, Fundamental and Applied Sciences, Environmental Engineering, Electrical & Electronic Engineering, Computing Science & IT Engineering, Biomedical Engineering, Chemical Engineering, Civil Engineering and More. 2017 TICEAS will take place from February 21-23, 2017 in Singapore. Prospective authors are invited to submit original research abstracts or full papers which were not, are not and have not been submitted/published/under consideration in other conferences and journals. For more information, please visit: http://ticeas.org or contact: t[email protected] Organized by Higher Education Forum
Posting date:
24 May 2016
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Placement:
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