When: |
08 Mar 2026 through 11 Mar 2026 | |
CFP Deadline: |
20 |
|
Where: |
Chicago, Illinois United States | |
Website URL: |
https://tei.acm.org | |
Sponsoring organization: |
ACM SIGCHI | |
Categories: |
Engineering & Technology - Other |
Keywords:
Event description:
ACM SIGCHI flagship conference on tangible, embedded, and embodied interaction, bringing together HCI, design, and engineering.
Posting date:
04 March 2026 | 6 views
Placement:
featured event (How do I make my event featured?)
