When: |
22 Apr 2015 through 24 Apr 2015 | |
CFP Deadline: |
20 Feb 2015 | |
Where: |
Chengdu, Sichuan, China | |
Website URL: |
http://aseai.org/ | |
Sponsoring organization: |
Higher Education Forum | |
Categories: |
Engineering & Technology > Electrical/ Electronic |
Event description:
The 3rd Asia Symposium on Engineering and Information (ASEAI) is planned to be held on 2015 April 22- 24 in Chengdu, China. ASEAI is the premier forum for the presentation and exchange of past experiences and new advances and research results in the field of theoretical,experimental and applied Engineering and Information. Papers of original work are invited in any of the areas range from bimolecular engineering, geotechnical engineering, computer engineering, aerospace engineering and building services engineering to computational intelligence, information & data security and satellite & space communications. Each of these topic areas is expanded in the "Call for Papers" section, but the sub-topics list is not exhaustive. Papers may address one or more of the listed as well as unlisted but related sub-topics.
Posting date:
10 February 2015
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